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RF/IF & RFID
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Integrated Circuits (ICs)
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Part Number |
Manufacturers
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Desc
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In Stock
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Packing
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NXP USA Inc. |
PowerPC e300c4s Microprocessor MPC83xx Series MPC8379 689-BBGA Exposed Pad
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602 |
689-BBGA Exposed Pad |
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NXP USA Inc. |
PowerPC e500 Microprocessor MPC85xx Series MPC8572 1023-BFBGA, FCBGA
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660 |
1023-BFBGA, FCBGA |
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NXP USA Inc. |
PowerPC e500 Microprocessor MPC85xx Series MPC8536 783-BBGA, FCBGA
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340 |
783-BBGA, FCBGA |
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NXP USA Inc. |
PowerPC e500 Microprocessor MPC85xx Series MPC8572 1023-BFBGA, FCBGA
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801 |
1023-BFBGA, FCBGA |
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NXP USA Inc. |
PowerPC e500 Microprocessor MPC85xx Series MPC8548 783-BBGA, FCBGA
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824 |
783-BBGA, FCBGA |
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NXP USA Inc. |
PowerPC e500 Microprocessor MPC85xx Series MPC8548 783-BBGA, FCBGA
|
238 |
783-BBGA, FCBGA |
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NXP USA Inc. |
1mm PowerPC e500v2 1.11.8/2.52.5/3.3V 32-bit Microprocessor MPC85xx Series MPC8567 1.1V 1023-BBGA, FCBGA
|
694 |
1023-BBGA, FCBGA |
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NXP USA Inc. |
PowerPC e500 Microprocessor MPC85xx Series MPC8572 1023-BFBGA, FCBGA
|
988 |
1023-BFBGA, FCBGA |
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NXP USA Inc. |
PowerPC e500 Microprocessor MPC85xx Series MPC8535 783-BBGA, FCBGA
|
157 |
783-BBGA, FCBGA |
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Microchip Technology |
8-WFDFN Exposed Pad Thermal Management
|
889 |
8-WFDFN Exposed Pad |
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Analog Devices Inc. |
16-SSOP (0.154, 3.90mm Width) Thermal Management Contains Lead
|
436 |
16-SSOP (0.154, 3.90mm Width) |
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Rochester Electronics, LLC |
24-TSSOP (0.173, 4.40mm Width) Thermal Management 7.8mm mm
|
652 |
24-TSSOP (0.173, 4.40mm Width) |
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Rochester Electronics, LLC |
24-TSSOP (0.173, 4.40mm Width) Thermal Management 7.8mm mm
|
737 |
24-TSSOP (0.173, 4.40mm Width) |
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Analog Devices Inc. |
14-CDIP (0.300, 7.62mm) Thermal Management 5V V19.55mm mmContains Lead
|
110 |
14-CDIP (0.300, 7.62mm) |
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Rochester Electronics, LLC |
48-LQFP Thermal Management 7mm mm
|
877 |
48-LQFP |
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Rochester Electronics, LLC |
16-SSOP (0.154, 3.90mm Width) Thermal Management
|
896 |
16-SSOP (0.154, 3.90mm Width) |
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Rochester Electronics, LLC |
16-SSOP (0.154, 3.90mm Width) Thermal Management 4.9022mm mm
|
791 |
16-SSOP (0.154, 3.90mm Width) |
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Rochester Electronics, LLC |
16-SSOP (0.154, 3.90mm Width) Thermal Management
|
873 |
16-SSOP (0.154, 3.90mm Width) |
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Rochester Electronics, LLC |
16-SSOP (0.154, 3.90mm Width) Thermal Management
|
985 |
16-SSOP (0.154, 3.90mm Width) |
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Rochester Electronics, LLC |
16-SSOP (0.154, 3.90mm Width) Thermal Management 4.9022mm mm
|
766 |
16-SSOP (0.154, 3.90mm Width) |
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Maxim Integrated |
16-SSOP (0.154, 3.90mm Width) Thermal Management 4.89mm mm
|
773 |
16-SSOP (0.154, 3.90mm Width) |
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Rochester Electronics, LLC |
14-CDIP (0.300, 7.62mm) Thermal Management
|
300 |
14-CDIP (0.300, 7.62mm) |
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Rochester Electronics, LLC |
16-SSOP (0.154, 3.90mm Width) Thermal Management
|
138 |
16-SSOP (0.154, 3.90mm Width) |
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Microchip Technology |
8-TSSOP (0.173, 4.40mm Width) Thermal Management 3mm mmLead Free
|
636 |
8-TSSOP (0.173, 4.40mm Width) |
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Rochester Electronics, LLC |
24-SSOP (0.154, 3.90mm Width) Thermal Management 8.65mm mm
|
948 |
24-SSOP (0.154, 3.90mm Width) |
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Rochester Electronics, LLC |
10-TFSOP, 10-MSOP (0.118, 3.00mm Width) Thermal Management
|
707 |
10-TFSOP, 10-MSOP (0.118, 3.00mm Width) |
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Rochester Electronics, LLC |
16-SSOP (0.154, 3.90mm Width) Thermal Management
|
956 |
16-SSOP (0.154, 3.90mm Width) |
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Rochester Electronics, LLC |
TO-100-10 Metal Can Thermal Management
|
889 |
TO-100-10 Metal Can |
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Rochester Electronics, LLC |
16-SSOP (0.154, 3.90mm Width) Thermal Management 4.9022mm mm
|
986 |
16-SSOP (0.154, 3.90mm Width) |
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Rochester Electronics, LLC |
24-TSSOP (0.173, 4.40mm Width) Thermal Management
|
362 |
24-TSSOP (0.173, 4.40mm Width) |
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